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W241024A 128K x 8 HIGH SPEED CMOS STATIC RAM
GENERAL DESCRIPTION
The W241024A is a high speed, low power CMOS static RAM organized as 131072 x 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology.
FEATURES
* *
High speed access time: 12/15/20 nS (max.) Low power consumption: - Active: 600 mW (typ.) Single +5V power supply Fully static operation
* * *
All inputs and outputs directly TTL compatible Three-state outputs Available packages: 32-pin 300 mil SOJ, 400 mil SOJ, skinny DIP and standard type one TSOP (8 mm x 20 mm), and small type one TSOP (8 mm x 13.4 mm)
* *
PIN CONFIGURATIONS
BLOCK DIAGRAM
VDD VSS A0 . . A16
NC A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O 1 I/O 2 I/O 3 VSS
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
VDD A15 CS2 WE A13 A8 A9 A11 OE A1 0 CS1 I/O 8 I/O 7 I/O 6 I/O 5 I/O 4
DECODER
CORE ARRAY
CS2 CS1 OE WE CONTROL DATA I/O I/O1 . . I/O8
PIN DESCRIPTION
SYMBOL A0-A16 I/O1-I/O8 CS1, CS2 WE OE VDD VSS NC DESCRIPTION Address Inputs Data Inputs/Outputs Chip Select Inputs Write Enable Input Output Enable Input Power Supply Ground No Connection
A11 A9 A8 A13 WE CS2 A15 VDD NC A16 A14 A12 A7 A6 A5 A4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
32-pin TSOP
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
OE A10 CS1 I/O8 I/O7 I/O6 I/O5 I/O4 VSS DQ3 DQ2 DQ1 A0 A1 A2 A3
-1-
Publication Release Date: July 1998 Revision A9
W241024A
TRUTH TABLE
CS1 H X L L L CS2 X L H H H OE X X H L X WE X X H H L MODE Not Selected Not Selected Output Disable Read Write I/O1-I/O8 High Z High Z High Z Data Out Data In VDD CURRENT ISB, ISB1 ISB, ISB1 IDD IDD IDD
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER Supply Voltage to VSS Potential Input/Output to VSS Potential Allowable Power Dissipation Storage Temperature Operating Temperature RATING -0.5 to +7.0 -0.5 to VDD +0.5 1.0 -65 to +150 0 to +70 UNIT V V W C C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
Operating Characteristics
(VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C)
PARAMETER Input Low Voltage Input High Voltage Input Leakage Current Output Leakage Current
SYM. VIL VIH ILI ILO
TEST CONDITIONS VIN = VSS to VDD VI/O = VSS to VDD CS1 = VIH (min.) or CS2 = VIL (max.) or OE = VIH (min.) or WE = VIL (max.) IOL = +8.0 mA IOH = -4.0 mA 12 CS1 = VIL (max.), and CS2 = VIH (min.) I/O = 0 mA, Cycle = min. Duty = 100% 15 20
MIN. -0.5 +2.2 -10 -10
TYP. -
MAX. +0.8 VDD +0.5 +10 +10
UNIT V V A A
Output Low Voltage Output High Voltage Operating Power Supply Current
VOL VOH IDD
2.4 -
-
0.4 200 200 170 30 10
V V mA mA mA mA mA
Standby Power Supply Current
ISB ISB1
CS1 = VIH (min.), or CS2 = VIL (max.) Cycle = min.
CS1 VDD -0.2V or CS2 0.2V
Note: Typical characteristics are at VDD = 5V, TA = 25 C.
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W241024A
CAPACITANCE
(VDD = 5V, TA = 25 C, f = 1 MHz)
PARAMETER Input Capacitance Input/Output Capacitance
SYM. CIN CI/O
CONDITIONS VIN = 0V VOUT = 0V
MAX. 8 10
UNIT pF pF
Note: These parameters are sampled but not 100% tested.
AC CHARACTERISTICS
AC Test Conditions
PARAMETER Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Output Load 0V to 3V 5 nS 1.5V CL = 30 pF, IOH/IOL = -4 mA/8 mA CONDITIONS
AC Test Loads and Waveform
R1 480 ohm R1 480 ohm 5V OUTPUT OUTPUT 30 pF Including Jig and Scope R2 255 ohm 5pF Including Jig and Scope R2 255 ohm 5V
(For T OW ) CLZ1, TCLZ2, TOLZ, TCHZ1, TCHZ2, TOHZ, TWHZ, T
3.0V
90% 10% 5 nS 10%
90%
0V
5 nS
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Publication Release Date: July 1998 Revision A9
W241024A
AC Characteristics, continued (VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C)
Read Cycle
PARAMETER Read Cycle Time Address Access Time Chip Select Access Time
CS1
SYM. TRC TAA TACS1 TACS2 TAOE
CS1
W241024A-12
W241024A-15
W241024A-20
UNIT nS nS nS nS nS nS nS nS nS nS nS nS
MIN. 12 3 3 0 3
MAX. 12 12 12 6 6 6 6 -
MIN. 15 3 3 0 3
MAX. 15 15 15 7 7 7 7 -
MIN. 20 3 3 0 3
MAX. 20 20 20 10 10 10 10 -
CS2 Output Enable to Output Valid Chip Selection to Output in Low Z
TCLZ1* TCLZ2* TOLZ* TCHZ1* TCHZ2* TOHZ* TOH
CS2 Output Enable to Output in Low Z Chip Deselection to Output in High Z Output Disable to Output in High Z Output Hold from Address Change
CS1
CS2
* These parameters are sampled but not 100% tested.
Write Cycle
PARAMETER Write Cycle Time Chip Selection to End of Write
CS1
SYM. TWC TCW1 TCW2 TAW TAS TWP
CS1 , WE
W241024A-12
W241024A-15
W241024A-20
UNIT nS nS nS nS nS nS nS nS nS nS nS nS nS
MIN. 12 10 10 10 0 10 0 0 7 0 0
MAX. 7 7 -
MIN. 15 13 13 13 0 10 0 0 9 0 0
MAX. 8 8 -
MIN. 20 17 17 17 0 12 0 0 10 0 0
MAX. 10 10 -
CS2 Address Valid to End of Write Address Setup Time Write Pulse Width Write Recovery Time
TWR1 TWR2 TDW TDH TWHZ* TOHZ* TOW
CS2 Data Valid to End of Write Data Hold from End of Write Write to Output in High Z Output Disable to Output in High Z Output Active from End of Write
* These parameters are sampled but not 100% tested.
-4-
W241024A
TIMING WAVEFORMS
Read Cycle 1
(Address Controlled)
TRC Address TAA TOH
TOH D OUT
Read Cycle 2
(Chip Select Controlled)
CS1 TACS1 CS2 TACS2 TCHZ2 TCHZ1
TCLZ1 DOUT TCLZ2
Read Cycle 3
(Output Enable Controlled)
TRC Address TAA OE TAOE TOLZ CS1 TACS1 TCLZ1 CS2 T ACS2 TCLZ2 DOUT TCHZ2 TOHZ TCHZ1 TOH
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Publication Release Date: July 1998 Revision A9
W241024A
Timing Waveforms, continued
Write Cycle 1
(OE Clock)
T WC Address TWR1 OE TCW1 CS1
CS2 TAW WE TAS TOHZ (1, 4) D OUT
TCW2 TWR2 TWP
TDW D IN
TDH
Write Cycle 2
(OE = VIL Fixed)
TWC Address T CW1 CS1 TWR1
CS2 TAW WE TAS
TCW2 TWR2 T WP TWHZ (1, 4) TOH TOW TDH (2) (3)
D OUT TDW D IN
Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. Dout provides the read data for the next address. 4. Transition is measured 500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.
-6-
W241024A
ORDERING INFORMATION
PART NO. ACCESS TIME (nS) 12 15 20 12 15 20 12 15 20 12 15 20 12 15 20 OPERATING CURRENT MAX. (mA) 200 200 170 200 200 170 200 200 170 200 200 170 200 200 170 STANDBY CURRENT MAX. (mA) 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 PACKAGE
W241024AI-12 W241024AI-15 W241024AI-20 W241024AJ-12 W241024AJ-15 W241024AJ-20 W241024AK-12 W241024AK-15 W241024AK-20 W241024AQ-12 W241024AQ-15 W241024AQ-20 W241024AT-12 W241024AT-15 W241024AT-20
400 mil SOJ 400 mil SOJ 400 mil SOJ 300 mil SOJ 300 mil SOJ 300 mil SOJ 300 mil skinny DIP 300 mil skinny DIP 300 mil skinny DIP Small type one TSOP Small type one TSOP Small type one TSOP Standard type one TSOP Standard type one TSOP Standard type one TSOP
Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure.
-7-
Publication Release Date: July 1998 Revision A9
W241024A
PACKAGE DIMENSIONS
32-pin P-DIP Skinny (300 mil)
Dimension in Inches Dimension in mm
Symbol
Min. Nom. Max.
0.200 0.015 0.145 0.016 0.058 0.008 0.150 0.018 0.060 0.010 1.60 0.295 0.286 0.090 0.120 0 0.430 0.450 0.315 0.290 0.100 0.130 0.155 0.022 0.064 0.014 1.62 0.335 0.294 0.110 0.140 15 0.470 0.065
Min. Nom. Max.
5.08 0.38 3.68 0.41 1.47 0.20 3.81 0.46 1.52 0.25 40.64 7.49 7.26 2.29 3.05 0 10.92 11.43 8.00 7.36 2.54 3.30 3.94 0.56 1.63 0.36 41.15 8.50 7.46 2.79 3.56 15 11.94 1.65
D
32 17
E1
1
16
A A1 A2 B B1 c D E E1 e1 L
a
eA S
Notes:
S E
Base Plane
A A2 L B1 B e1 a A1
c
Mounting Plane
eA
1. Dimension D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash. 3. Dimension D & E1 include mold mismatch and are determined at the mold parting line. 4. Dimension B1 does not include dambar protrusion/intrusion. 5. Controlling dimension: Inches. 6. General appearance spec. should be based on final visual inspection spec.
32-pin SOJ (300 mil)
Dimension in Inches Dimension in mm
32
17
Symbol A A1 A2
E He
Min.
__ 0.020 0.095 0.026 0.016 0.008 0.815 0.295 0.044
Nom.
__ __ 0.100 0.028 0.018 0.010 0.825 0.300 0.050 0.267 0.335 __ __ __ __
Max.
0.140 __ 0.105 0.032 0.022 0.014 0.835 0.305 0.056 0.287 0.345 __ 0.045 0.004 10
Min.
__ 0.508 2.413 0.660 0.406 0.203 20.701 7.493 1.118 6.274 8.255 2.032 __ __ 0
Nom.
__ __ 2.540 0.711 0.457 0.254 20.955 7.620 1.270 6.782 8.509 __ __ __ __
Max.
3.556 __ 2.667 0.813 0.559 0.356 21.209 7.747 1.422 7.290 8.763 __ 1.143 0.102 10
B b c D E e
1
16
e He
1
0.247 0.325 0.080 __ __ 0
L S Y
D
A2
A L
c
e1
S B b
e
A1
Y
Seating Plane
-8-
W241024A
Package Dimensions, continued
32-pin SOJ (400 mil)
Dimension in inches
Dimension in mm Min. 3.33 0.635 Nom. 3.51 Max. 3.68
Symbol
32 17
Min.
Nom.
Max. 0.145
E
HE
1
16
D c A2 A s Seating Plane y b b1 e A1 L e1
A A1 A2 b1 b c D E e e1 HE L S y
Notes:
0.131 0.138 0.025 0.105 0.110 0.026 0.028 0.016 0.018 0.006 0.008 0.820 0.825 0.395 0.400
0.115 0.032 0.020 0.011 0.830 0.405 0.056 0.380 0.445
2.67 0.66 0.41 0.15 20.83 10.03 1.12 9.15 11.05 2.08
2.79 0.71 0.46 0.20
2.91 0.81 0.51 0.28
20.96 21.08 10.16 10.29 1.27 9.40 11.18 1.42 9.65 11.31
0.044 0.050 0.360 0.37 0.435 0.082 0.440
0.045 0.004 -5 2 6 -5 2
1.14 0.10 6
1. Dimension D Max & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimension D & E include mold mismatch and are determined at the mold parting line. 4. Controlling dimension: Inches 5. General appearance spec. should be based on final visual inspection spec.
32-pin Standard Type One TSOP
HD
Symbol
Dimension in Inches Min. Nom. Max. 0.047 0.006 0.041 0.009 0.007
Dimension in mm Min. Nom. Max. 1.20 0.15 1.05 0.23 0.17 18.50 8.10 20.20
D c
A A1 A2
__
0.002 0.037 0.007
__ __
0.039 0.008
__
0.05 0.95 0.17 0.12
__ __
1.00 0.20 0.15
M
e E
b c D E HD e L L1
A A2
0.005 0.006 0.720 0.311 0.780 0.724 0.315 0.787 0.020 0.020 0.031
0.10(0.004)
0.728 18.30 18.40 0.319 7.90 8.00 20.00 0.50 0.50 0.80
b
0.795 19.80
__
0.016
__
0.024
__
0.40
__
0.60
__
0.000 1
__
0.004 5
__
0.00 1
__
0.10 5
Y
__
3
__
3
L L1
A1
Y
Note:
Controlling dimension: Millimeter
-9-
Publication Release Date: July 1998 Revision A9
W241024A
Package Dimensions, continued
32-pin Small Type One TSOP
HD
Symbol
Dimension in Inches Min. Nom. Max. 0.049 0.002 0.006
Dimension in mm Min. Nom. Max. 1.25 0.05 0.95 0.17 1.00 0.20 0.15 0.15 1.05 0.27 0.16
D c
1
A A1 A2 b c D E HD e L L1
e
E
0.037 0.039 0.041 0.007 0.008 0.009
0.0056 0.0059 0.0062 0.14 0.461
b
0.465 0.469 11.70 11.80 11.90 7.90 8.00 8.10
0.311 0.315 0.319
0.520 0.528 0.536 13.20 13.40 13.60 0.020 0.012 0.020 0.028 0.027 0.000 0 3 0.004 5 0.30 0.675 0.00 0 3 0.10 5 0.50 0.50 0.70
A A
2
Y
Y
L L1
A1
Controlling dimension: Millimeters
- 10 -
W241024A
VERSION HISTORY
VERSION A9 DATE Jul. 1998 PAGE 1, 7, 10 DESCRIPTION Add small type one TSOP (8 mm x 13.4 mm) package
Headquarters
No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5792647 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-7197006
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II, 123 Hoi Bun Rd., Kwun Tong, Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064
Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab.
2730 Orchard Parkway, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-9436668
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-7190505 FAX: 886-2-7197502
Note: All data and specifications are subject to change without notice.
- 11 -
Publication Release Date: July 1998 Revision A9

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